The maximum stress analysis effectively indicates the location of maximum bending stress on the die during dicing process while the principle of fracture mechanics subsequently predicts the theoretical critical crack length for which the presence of micro-void or crack will propagate, thus leading to a brittle fracture on the backside of the die. With the critical parameters like saw blade and cutting speed, one can control this process to some extent for these thin and narrow saw streets between dies on a wafer. AI Technology serves clients throughout San Diego, Chula Vista, National City, Mission Valley, Miramar, Mira Mesa, San Jose & San Francisco, CA and surrounding cities. This paper focuses mainly on backside chipping issues as a result of crack propagation during saw. Advanced International Technology specializes in precision wafer dicing services with high fidelity and rapid turnaround time. Thinner wafers are more prone to cracks even before saw because of the stress management during the backgrind process. The need for backgrind wafers has become critical with package thickness reducing to as low as 0.7mm. With shrinking technologies evolving, new products are launched in fine pitches, not only from a pad pitch standpoint but also from a reduction in distance between line widths, narrower scribe widths with e-test patterns built on the scribes, after a straight shrink in dimensions.
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